BGA
What does BGA mean in a BOM?
An IC package with solder balls in a grid underneath the chip, used for high pin-count devices. BGA parts need specific assembly capability, and package is a fixed attribute of the BOM line.
Related terms
Every part on your BOM, resolved automatically.
O2 reads a bill of materials end to end: it normalizes part numbers, checks lifecycle and compliance on every line, finds alternates, and drafts the quote.